On 24 March 2016, commissioned by the Beijing haidian district development and reform Commission, Beijing municipal engineering consulting corporation organized an acceptance check for “Beijing Municipal Engineering Laboratory of Electrical Drive System & Power Electronic Device Packaging Technology Innovation Ability Construction Project” at the Institute of electrical engineering, Chinese Academy of Sciences. The laboratory director of Prof. Xuhui Wen reported the laboratory construction works and achievements for the experts. The experts agreed that this project had completed the desired objectives and met the acceptance criteria. Officials from Beijing haidian district development and reform Commission and the Institute of electrical engineering, Chinese Academy of Sciences attended the examination meeting.
The construction of “Beijing Municipal Engineering Laboratory of Electrical Drive System & Power Electronic Device Packaging Technology” was approved in 2011 by Beijing Municipal Commission of Development & Reform with 43.13 million RMB total investment of the project. The construction of the comprehensive research platform of power semiconductor module packaging, testing and application with a total construction area of 600 square meters was completed. By March 2016, the laboratory totally applied for invention patents of 20 and published 38 academic papers about power semiconductor packaging and testing, and presided over drafting of one occupation standard. The laboratory also applied for six research projects, which achieved good social and economic benefits.
